On Sunday, Odisha Chief Minister Mohan Majhi inaugurated India's first advanced glass substrate-based chip packaging unit in Bhubaneswar, a project by US-based 3D Glass Solutions Inc. with an investment of approximately ₹1,943 crore (roughly $233 million USD). This facility aims to reduce India's dependency on imported semiconductor packaging technology, particularly for critical applications such as artificial intelligence, 5G networks, and defense systems. Union Electronics and IT Minister Ashwini Vaishnaw hailed the event as a 'historical day' for Odisha, emphasizing the state's transition from a focus on metals and minerals to becoming a hub for IT and electronics manufacturing. The plant is designed to produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually, and is expected to create over 2,500 jobs. This initiative is part of India's larger ambition to develop a self-reliant semiconductor ecosystem, following the approval of multiple semiconductor projects nationwide.