On Sunday, Odisha's Chief Minister Mohan Charan Majhi laid the foundation stone for India's first glass substrate chip packaging plant in Bhubaneswar, developed by US-based 3D Glass Solutions Inc. The facility, valued at ₹1,943 crore (approximately $234 million USD), will employ advanced 3D heterogeneous integration (3DHI) technology, which India previously relied on imports to access. Union Electronics and IT Minister Ashwini Vaishnaw highlighted the significance of this high-tech industry, marking a shift from traditional silicon substrates to advanced glass substrates. The plant is set to produce 69,600 glass panel substrates and 50 million assembled units annually, generating over 2,500 jobs. This project, along with another semiconductor facility by SiCSem Private Limited, is part of a broader initiative approved by the Union Cabinet in 2025 to foster a self-reliant semiconductor ecosystem in India, with a total investment exceeding ₹1.6 lakh crore (approximately $19.2 billion USD).