Samsung is reportedly set to unveil its next-generation flagship chipset, the Exynos 2700, for the upcoming Galaxy S27 series, with significant changes in its packaging design. Moving away from the Fan-Out Wafer-Level Packaging (FOWLP) technology, which has been utilized since the Exynos 2400, the company plans to adopt a new Side-by-Side (SbS) architecture. This innovative design will position the application processor (AP) and DRAM side by side on the substrate, rather than stacking them, which could enhance performance and efficiency. The transition to SbS aims to address profitability concerns associated with FOWLP’s complex and costly manufacturing process. Additionally, the Exynos 2700 is expected to incorporate Heat Pass Block (HPB) technology, which is designed to improve heat dissipation and overall thermal efficiency. The Galaxy S27 and Galaxy S27+ are anticipated to launch in early 2027, marking a significant step for Samsung in its chipset development. Observers are keen to see how these changes will influence the thermal performance and efficiency of the new chipset.