According to analyst Ming-Chi Kuo, OpenAI's anticipated AI-agent smartphone is set to begin mass production in the first half of 2027, accelerating from earlier estimates of 2028. This shift is attributed to the rapidly growing AI phone market and a potential initial public offering (IPO) by year-end. The smartphone will feature a custom MediaTek Dimensity 9600 system-on-chip (SoC), built using TSMC’s advanced N2P process. Key specifications include a dual-NPU architecture to handle AI tasks, LPDDR6 RAM, and UFS 5.0 storage. Imaging will be a major focus, with an enhanced HDR pipeline for improved visual sensing. If development proceeds as planned, total shipments could reach 30 million units across 2027 and 2028.