AMD is already generating buzz about its upcoming Zen 7 CCD, even before the release of Zen 6. Predicted to debut between 2027 and 2028, the Zen 7 will reportedly feature a significant 288 physical cores in its top-spec Epyc CPUs, codenamed Florence. The Zen 7 CCD is designed to support up to 16 cores and 224 MB of L3 cache with a 3D V-cache tile, leveraging TSMC's advanced A14 node technology for improved efficiency. However, unlike Intel's newer nodes, TSMC's A14 will not support backside power delivery, which is anticipated in future revisions. Additionally, some components may be manufactured by Samsung Foundry, particularly for laptop CPUs, indicating AMD's strategy to diversify its supply chain. This move comes as AMD seeks to balance production costs against potential competition from Intel's 14A products. The integration of cutting-edge technologies like FOPLP (Fan-Out Panel-Level Packaging) further positions AMD to maintain a competitive edge in the high-performance chip market.