India has laid the foundation for its first advanced 3D chip packaging unit in Bhubaneswar, Odisha, with an investment of ₹1,934 crore (approximately $233 million USD) as part of the India Semiconductor Mission (ISM). This facility, led by US-based 3D Glass Solutions, aims to produce glass substrate panels and advanced 3D heterogeneous integration modules, which are crucial for applications in artificial intelligence, 5G, and defense. IT Secretary S Krishnan emphasized the project's significance, stating it positions India at the forefront of semiconductor technology. The facility is expected to manufacture 70,000 glass panels annually and 50 million assembled units, contributing to the creation of around 2,500 jobs. The ISM, launched in 2021 with a budget of ₹76,000 crore, aims to establish a comprehensive semiconductor ecosystem in India, which includes various projects across six states totaling over ₹1.6 lakh crore (approximately $19.3 billion USD) in investments. Future iterations of the ISM may focus on supporting ancillary industries and enhancing design capabilities within the semiconductor sector.