Samsung is reportedly developing advanced cooling technologies to tackle thermal throttling issues in its flagship smartphones, particularly those handling intensive AI workloads. The company is evaluating both liquid and air cooling solutions, with a dedicated team from the Production Technology Research Institute leading the research. Lab director Park Min indicated that a liquid cooling system, which would utilize a sealed, circulating loop connected directly to the chipset, is being prioritized due to concerns about noise and weight associated with fan-based air cooling. While the current flagship SoC, the Exynos 2600, employs 'Heat Pass Block' technology for improved thermal stability, Samsung acknowledges that future AI-driven applications will necessitate more robust cooling systems. This shift towards active cooling mirrors trends seen in gaming-focused smartphones, such as those from Nubia. By implementing these technologies, Samsung aims to ensure that its upcoming flagship models, including the Galaxy S27 Ultra, can sustain peak performance without relying solely on passive cooling methods.